Patent Assignment Details
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| Reel/Frame: | 056087/0111 | |
| Pages: | 8 |
| | Recorded: | 04/29/2021 | | |
| Attorney Dkt #: | HARA1PUS01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17288519
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Filing Dt:
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04/24/2021
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Publication #:
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Pub Dt:
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12/16/2021
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Title:
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HOT-DIP PLATING METHOD
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Assignee
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| 6-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8071 |
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Correspondence name and address
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RENNER OTTO
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1621 EUCLID AVENUE
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19TH FLOOR
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CLEVELAND, OH 44115
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