Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056270/0964 | |
| Pages: | 9 |
| | Recorded: | 05/18/2021 | | |
| Attorney Dkt #: | USCP11015C/NB7926-SYO |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17323079
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Filing Dt:
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05/18/2021
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Publication #:
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Pub Dt:
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09/22/2022
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Title:
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Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof
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Assignee
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| 66-68 SHUNYU ROAD, |
| YUYAO CITY, NINGBO, ZHEJIANG PROVINCE, CHINA 315400 |
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Correspondence name and address
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DAVID AND RAYMOND PATENT FIRM
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108 N. YNEZ AVE., SUITE 128
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MONTEREY PARK, CA 91754
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