Patent Assignment Details
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Reel/Frame: | 056323/0478 | |
| Pages: | 52 |
| | Recorded: | 05/17/2021 | | |
Attorney Dkt #: | 20374-142796-US |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/22/2021
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Application #:
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15757896
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Filing Dt:
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03/06/2018
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Publication #:
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Pub Dt:
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04/09/2020
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Title:
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COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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9-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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1250 23RD STREET NW, SUITE 410
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WASHINGTON, DC 20037-1164
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05/09/2024 08:43 AM
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