Patent Assignment Details
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| Reel/Frame: | 056328/0850 | |
| Pages: | 4 |
| | Recorded: | 05/24/2021 | | |
| Attorney Dkt #: | 695LEAD0003US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17327027
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Filing Dt:
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05/21/2021
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Publication #:
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Pub Dt:
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09/09/2021
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Title:
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CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND SUPERCOMPUTING DEVICE
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Assignee
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| F2, BUILDING 25, COURTYARD 1, BAOSHENG SOUTH ROAD, |
| HAIDIAN DISTRICT, |
| BEIJING, CHINA 100192 |
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Correspondence name and address
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AMPACC LAW GROUP, PLLC
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6100 219TH ST SW #580
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MOUNTLAKE TERRACE, WA 98043
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05/21/2024 09:39 PM
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