Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056332/0870 | |
| Pages: | 4 |
| | Recorded: | 05/24/2021 | | |
| Attorney Dkt #: | 2018-2436/24061.3811US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/20/2022
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Application #:
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17328655
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Filing Dt:
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05/24/2021
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Publication #:
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Pub Dt:
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09/09/2021
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Title:
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Methods of Forming Contact Features in Semiconductor Devices
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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HAYNES AND BOONE, LLP (24061) IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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