Patent Assignment Details
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| Reel/Frame: | 056367/0786 | |
| Pages: | 4 |
| | Recorded: | 05/27/2021 | | |
| Attorney Dkt #: | TSMCP1337US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17317977
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Filing Dt:
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05/12/2021
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Title:
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DAMAGE PREVENTION DURING WAFER EDGE TRIMMING
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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ROSETTA CENTER
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629 EUCLID AVE., SUITE 1000
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CLEVELAND, OH 44114
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05/14/2024 05:28 AM
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