Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056391/0171 | |
| Pages: | 22 |
| | Recorded: | 05/31/2021 | | |
| Attorney Dkt #: | XMEP0122USA4 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/15/2022
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Application #:
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17334831
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Filing Dt:
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05/31/2021
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Publication #:
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Pub Dt:
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09/23/2021
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Title:
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PACKAGE STRUCTURE AND METHODS OF MANUFACTURING SOUND PRODUCING CHIP, FORMING PACKAGE STRUCTURE AND FORMING SOUND PRODUCING APPARATUS
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Assignee
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| 3255 KIFER ROAD |
| SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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