Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056423/0628 | |
| Pages: | 7 |
| | Recorded: | 05/28/2021 | | |
| Attorney Dkt #: | 20901-152256-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17297966
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Filing Dt:
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05/27/2021
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Publication #:
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Pub Dt:
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04/07/2022
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Title:
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LEAD-FREE SOLDER ALLOY
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Assignee
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| 1-16-15, ESAKACHO, SUITA-SHI |
| OSAKA, JAPAN 5640063 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY LLP
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120 SOUTH LASALLE STREET
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SUITE 2100
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CHICAGO, IL 60603-3406
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04/28/2024 09:28 PM
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