Patent Assignment Details
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| Reel/Frame: | 056551/0225 | |
| Pages: | 4 |
| | Recorded: | 06/15/2021 | | |
| Attorney Dkt #: | OHTKYO-PT002 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17414164
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Filing Dt:
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06/15/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Title:
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COPPER PARTICLE, METHOD FOR PRODUCING COPPER PARTICLE, COPPER PASTE, SEMICONDUCTOR DEVICE, AND ELECTRICAL/ELECTRONIC COMPONENT
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Assignee
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| 6, TAKEDA TOBADONO-CHO |
| FUSHIMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 612-8501 |
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Correspondence name and address
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VOLPE KOENIG
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30 SOUTH 17TH STREET, 18TH FLOOR
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PHILADELPHIA, 19103 UNITED STATES
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05/12/2024 02:43 AM
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