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Reel/Frame:056571/0541   Pages: 3
Recorded: 06/17/2021
Attorney Dkt #:P201908317US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/17/2023
Application #:
17304252
Filing Dt:
06/17/2021
Publication #:
Pub Dt:
12/22/2022
Title:
FLEXIBLE COLD PLATE FOR CONTACTING VARIED AND VARIABLE CHIP HEIGHTS
Assignors
1
Exec Dt:
06/15/2021
2
Exec Dt:
06/15/2021
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM CORPORATION-PATENT CENTER
1701 NORTH STREET
B256-3
ENDICOTT, NY 13760

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