Patent Assignment Details
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| Reel/Frame: | 056605/0673 | |
| Pages: | 9 |
| | Recorded: | 06/21/2021 | | |
| Attorney Dkt #: | 11042.1001 C2 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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17352961
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Filing Dt:
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06/21/2021
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Publication #:
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Pub Dt:
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10/07/2021
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Title:
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SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR DEVICE BASED ON MOLDING PROCESS
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Assignee
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| 66-68 SHUNYU ROAD, YUYAO CITY |
| NINGBO, ZHEJIANG, CHINA 315400 |
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Correspondence name and address
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HARVEST IP LAW LLP
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1455 PENNSYLVANIA AVENUE NW, SUITE 400
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WASHINGTON, 20004 UNITED STATES
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