Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056612/0882 | |
| Pages: | 3 |
| | Recorded: | 06/17/2021 | | |
| Attorney Dkt #: | PN148330HTKS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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03/27/2012
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Application #:
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11867646
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Filing Dt:
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10/04/2007
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Publication #:
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Pub Dt:
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04/10/2008
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Title:
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WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS
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Patent #:
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Issue Dt:
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07/05/2011
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Application #:
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12107009
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Filing Dt:
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04/21/2008
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Publication #:
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Pub Dt:
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12/18/2008
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Title:
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SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO-MECHANICAL PERFORMANCE
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Patent #:
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Issue Dt:
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11/15/2011
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Application #:
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12537236
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Filing Dt:
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08/06/2009
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Publication #:
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Pub Dt:
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02/11/2010
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Title:
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ENHANCED RELIABILITY FOR SEMICONDUCTOR DEVICES USING DIELECTRIC ENCASEMENT
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Patent #:
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Issue Dt:
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05/29/2012
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Application #:
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13085759
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Filing Dt:
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04/13/2011
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Publication #:
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Pub Dt:
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08/04/2011
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Title:
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SOLDER BUMP INTERCONNECT
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Assignee
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| 112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE |
| KUNSHAN, JIANGSU, CHINA 215300 |
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Correspondence name and address
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GANG YU
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ACIP INTERNATIONAL, INC. 419 10TH ST,
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SF, CA 94103
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