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Patent Assignment Details
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Reel/Frame:056686/0538   Pages: 6
Recorded: 06/28/2021
Attorney Dkt #:249/1325_00
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 4
1
Patent #:
Issue Dt:
06/17/2014
Application #:
12709054
Filing Dt:
02/19/2010
Publication #:
Pub Dt:
02/02/2012
Title:
NON-AMINE POST-CMP COMPOSITION AND METHOD OF USE
2
Patent #:
Issue Dt:
05/17/2016
Application #:
14305786
Filing Dt:
06/16/2014
Publication #:
Pub Dt:
12/04/2014
Title:
NON-AMINE POST-CMP COMPOSITION AND METHOD OF USE
3
Patent #:
Issue Dt:
11/03/2015
Application #:
14348115
Filing Dt:
03/28/2014
Publication #:
Pub Dt:
08/28/2014
Title:
ETCHING AGENT FOR COPPER OR COPPER ALLOY
4
Patent #:
Issue Dt:
10/17/2017
Application #:
14929803
Filing Dt:
11/02/2015
Publication #:
Pub Dt:
02/25/2016
Title:
ETCHING AGENT FOR COPPER OR COPPER ALLOY
Assignor
1
Exec Dt:
06/14/2021
Assignee
1
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondence name and address
EUGENE M. LEE
LEE IP LAW, P.C.
3141 FAIRVIEW PARK DRIVE, SUITE 500
FALLS CHURCH, VA 22042

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