Patent Assignment Details
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| Reel/Frame: | 056944/0864 | |
| Pages: | 8 |
| | Recorded: | 07/22/2021 | | |
| Attorney Dkt #: | TSMCP694USD |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17382570
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Filing Dt:
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07/22/2021
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Publication #:
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Pub Dt:
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11/11/2021
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Title:
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INTEGRATED CHIP FOR STANDARD LOGIC PERFORMANCE IMPROVEMENT HAVING A BACK-SIDE THROUGH-SUBSTRATE-VIA AND METHOD FOR FORMING THE INTEGRATED CHIP
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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ROSETTA CENTER
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629 EUCLID AVE., SUITE 1101
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CLEVELAND, OH 44114
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