Patent Assignment Details
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| Reel/Frame: | 056950/0932 | |
| Pages: | 4 |
| | Recorded: | 07/22/2021 | | |
| Attorney Dkt #: | 105019-0043 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/04/2023
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Application #:
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17383162
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Filing Dt:
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07/22/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Title:
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METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
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Assignee
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| 2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI |
| KANAGAWA, JAPAN 222-0033 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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