Patent Assignment Details
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| Reel/Frame: | 057023/0552 | |
| Pages: | 9 |
| | Recorded: | 07/29/2021 | | |
| Attorney Dkt #: | RAYT71PUS01 (20-14363) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17361859
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Filing Dt:
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06/29/2021
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Publication #:
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Pub Dt:
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12/29/2022
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Title:
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LOW-STRESS DIELECTRIC LAYER, PLANARIZATION METHOD, AND LOW-TEMPERATURE PROCESSING FOR 3D-INTEGRATED ELECTRICAL DEVICE
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Assignee
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| 870 WINTER STREET |
| WALTHAM, MASSACHUSETTS 02451 |
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Correspondence name and address
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RICHARD A. WOLF
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1621 EUCLID AVENUE
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NINETEENTH FLOOR
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CLEVELAND, OH 44115
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