Patent Assignment Details
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Reel/Frame: | 057038/0603 | |
| Pages: | 32 |
| | Recorded: | 07/30/2021 | | |
Attorney Dkt #: | 20370-145637-US |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/2021
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Application #:
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16341764
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Filing Dt:
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04/12/2019
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Publication #:
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Pub Dt:
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08/01/2019
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Title:
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SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE
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Assignee
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9-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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1250 23RD STREET NW, SUITE 410
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WASHINGTON, DC 20037-1164
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