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Patent Assignment Details
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Reel/Frame:057081/0363   Pages: 8
Recorded: 08/04/2021
Attorney Dkt #:2557-003398-US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/25/2023
Application #:
17376883
Filing Dt:
07/15/2021
Publication #:
Pub Dt:
06/16/2022
Title:
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Assignors
1
Exec Dt:
05/26/2021
2
Exec Dt:
05/16/2021
3
Exec Dt:
05/26/2021
4
Exec Dt:
05/26/2021
5
Exec Dt:
05/26/2021
6
Exec Dt:
05/26/2021
7
Exec Dt:
05/26/2021
8
Exec Dt:
05/26/2021
Assignee
1
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondence name and address
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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