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Reel/Frame:057081/0650   Pages: 14
Recorded: 08/04/2021
Attorney Dkt #:HW754385
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17244410
Filing Dt:
04/29/2021
Publication #:
Pub Dt:
08/12/2021
Title:
Integrated Circuit Device and Preparation Method Thereof
Assignors
1
Exec Dt:
06/15/2021
2
Exec Dt:
05/29/2021
3
Exec Dt:
05/29/2021
4
Exec Dt:
06/15/2021
5
Exec Dt:
05/29/2021
6
Exec Dt:
05/29/2021
7
Exec Dt:
05/31/2021
8
Exec Dt:
05/31/2021
Assignee
1
HUAWEI ADMINISTRATION BUILDING
BANTIAN, LONGGANG DISTRICT
SHENZHEN, GUANGDONG, CHINA 518129
Correspondence name and address
LEYDIG, VOIT & MAYER, LTD.
TWO PRUDENTIAL PLAZA, SUITE 4900
180 NORTH STETSON AVENUE
CHICAGO, IL 60601-6731

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