Patent Assignment Details
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| Reel/Frame: | 057151/0127 | |
| Pages: | 2 |
| | Recorded: | 08/11/2021 | | |
| Attorney Dkt #: | 112753.PE779US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17399272
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Filing Dt:
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08/11/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Title:
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Die Bonding Apparatus and Manufacturing Method for Semiconductor Device
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Assignee
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| 610-5, SHIMOIMASUWA |
| MINAMI-ALPS CITY, YAMANASHI, JAPAN |
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Correspondence name and address
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CROWELL & MORING LLP
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1001 PENNSYLVANIA AVENUE, NW
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WASHINGTON, DC 20004
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05/03/2024 12:31 PM
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