Patent Assignment Details
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| Reel/Frame: | 057278/0409 | |
| Pages: | 3 |
| | Recorded: | 08/24/2021 | | |
| Attorney Dkt #: | 019175.0068 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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17433349
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Filing Dt:
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08/24/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Title:
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PACKAGING SUBSTRATE WITH CORE LAYER AND CAVITY STRUCTURE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME
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Assignee
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| 84, JANGAN-RO 309BEON-GIL, JANGAN-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF |
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Correspondence name and address
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NSIP LAW
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PO BOX 65745
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WASHINGTON, DC 20036
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