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Reel/Frame:057291/0412   Pages: 10
Recorded: 08/25/2021
Attorney Dkt #:CYPP0045USA3
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17412228
Filing Dt:
08/25/2021
Publication #:
Pub Dt:
04/14/2022
Title:
Laminated Electronic Device and Manufacturing Method Thereof
Assignors
1
Exec Dt:
08/12/2021
2
Exec Dt:
08/16/2021
3
Exec Dt:
08/16/2021
4
Exec Dt:
08/16/2021
Assignee
1
SUNLORD GUANLAN INDUSTRIAL PARK, DAFUYUAN INDUSTRIAL ZONE, GUANLAN STREET, LONGHUA DISTRICT
SHENZHEN, GUANGDONG, CHINA
Correspondence name and address
WINSTON HSU
5F., NO.389, FUHE RD., YONGHE DIST.,
NEW TAIPEI CITY, TAIWAN

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