Patent Assignment Details
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Reel/Frame: | 057397/0606 | |
| Pages: | 3 |
| | Recorded: | 09/07/2021 | | |
Attorney Dkt #: | 20372-153329-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/28/2023
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Application #:
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29806527
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Filing Dt:
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09/03/2021
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Title:
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SUBSTRATE MOUNTING PLATE FOR SUBSTRATE PROCESSING APPARATUS
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Assignee
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3-4, KANDAKAJI-CHO, CHIYODA-KU |
TOKYO, JAPAN 101-0045 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY
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120 SOUTH LASALLE STREET
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SUITE 2100
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CHICAGO, IL 60603
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05/04/2024 09:17 PM
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