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Reel/Frame:057493/0066   Pages: 15
Recorded: 08/11/2021
Attorney Dkt #:BOXP106WOUS
Conveyance: EMPLOYMENT AGREEMENT
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17430279
Filing Dt:
08/11/2021
Publication #:
Pub Dt:
04/20/2023
Title:
METHODS FOR FORMING SEMICONDUCTOR STRUCTURES AND SEMICONDUCTOR STRUCTURES
Assignor
1
Exec Dt:
09/30/2018
Assignee
1
NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK
ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA
HEFEI CITY, ANHUI, CHINA 230601
Correspondence name and address
COOPER LEGAL GROUP, LLC
6505 ROCKSIDE ROAD
SUITE 330
INDEPENDENCE, OH 44131

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