Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 057511/0670 | |
| Pages: | 5 |
| | Recorded: | 09/17/2021 | | |
| Attorney Dkt #: | 20371-152952-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17440238
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Filing Dt:
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09/17/2021
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Publication #:
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Pub Dt:
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06/09/2022
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Title:
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PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY
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120 SOUTH LASALLE STREET
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SUITE 2100
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CHICAGO, IL 60603
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