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Reel/Frame:057722/0386   Pages: 6
Recorded: 10/07/2021
Attorney Dkt #:104612-US-PA
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/10/2023
Application #:
17460329
Filing Dt:
08/30/2021
Publication #:
Pub Dt:
03/02/2023
Title:
SEMICONDUCTOR STRUCTURE, METHOD OF FORMING STACKED UNIT LAYERS AND METHOD OF FORMING STACKED TWO-DIMENSIONAL MATERIAL LAYERS
Assignors
1
Exec Dt:
01/19/2021
2
Exec Dt:
09/24/2021
3
Exec Dt:
01/19/2021
4
Exec Dt:
09/26/2021
Assignee
1
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondence name and address
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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