Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 057783/0749 | |
| Pages: | 3 |
| | Recorded: | 10/13/2021 | | |
| Attorney Dkt #: | 058752-01-5417-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/16/2024
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Application #:
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17486322
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Filing Dt:
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09/27/2021
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Publication #:
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Pub Dt:
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03/30/2023
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Title:
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Semiconductor Device Package Having Multi-Layer Molding Compound and Method
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Assignee
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| 5601 GREAT OAKS PARKWAY |
| SAN JOSE, CALIFORNIA 95119 |
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Correspondence name and address
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MICHAEL S. RYAN
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1701 MARKET STREET
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PHILADELPHIA, PA 19103
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Search Results as of:
05/09/2024 05:57 AM
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