Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 057784/0476 | |
| Pages: | 3 |
| | Recorded: | 10/13/2021 | | |
| Attorney Dkt #: | 754838 (P200859US01) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/28/2023
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Application #:
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17500590
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Filing Dt:
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10/13/2021
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Publication #:
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Pub Dt:
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04/13/2023
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Title:
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Apparatus and Method for Encapsulating an Electronic Component
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Assignee
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| BRUGGERSTRASSE 66 |
| BADEN, SWITZERLAND 5400 |
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Correspondence name and address
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DAVID P. MADIO
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LEYDIG, VOIT & MAYER, LTD.
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180 NORTH STETSON AVE., SUITE 4900
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CHICAGO, IL 60601-6731
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