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Reel/Frame:057820/0084   Pages: 3
Recorded: 10/18/2021
Attorney Dkt #:P12464US00/SJW
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17604553
Filing Dt:
10/18/2021
Publication #:
Pub Dt:
06/23/2022
Title:
NON-CONTACT APPARATUS FOR MEASURING WAFER THICKNESS
Assignors
1
Exec Dt:
08/18/2021
2
Exec Dt:
08/06/2021
3
Exec Dt:
08/19/2021
Assignee
1
1650, KIYONO, MATSUSHIRO-MACHI, NAGANO-SHI
NAGANO, JAPAN 381-1233
Correspondence name and address
STITES & HARBISON PLLC
1800 DIAGONAL ROAD
ALEXANDIRA, VA 22314

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