Patent Assignment Details
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Reel/Frame: | 057842/0106 | |
| Pages: | 3 |
| | Recorded: | 10/20/2021 | | |
Attorney Dkt #: | I2000.262.101 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/19/2023
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Application #:
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17411633
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Filing Dt:
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08/25/2021
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Publication #:
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Pub Dt:
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03/03/2022
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Title:
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BENDING SEMICONDUCTOR CHIP FOR CONNECTION AT DIFFERENT VERTICAL LEVELS
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Assignee
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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DICKE, BILLIG & CZAJA, PLLC
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100 SOUTH FIFTH STREET
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SUITE 2250
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MINNEAPOLIS, MN 55402
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05/10/2024 01:38 PM
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