Patent Assignment Details
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| Reel/Frame: | 057845/0483 | |
| Pages: | 12 |
| | Recorded: | 10/20/2021 | | |
| Attorney Dkt #: | 17723US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/16/2024
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Application #:
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17605002
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Filing Dt:
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10/20/2021
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Publication #:
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Pub Dt:
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07/21/2022
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Title:
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Method for manufacturing a semiconductor substrate and device by bonding an epitaxial substrate to a first support substrate, forming a first and second protective thin film layer, and exposing and bonding a nitride semiconductor layer to a second support substrate
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Assignee
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| 7-3, MARUNOUCHI 2-CHOME, |
| CHIYODA-KU, |
| TOKYO, JAPAN 1008310 |
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Correspondence name and address
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XSENSUS LLP
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100 DAINGERFIELD ROAD
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SUITE 402
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ALEXANDRIA, VA 22314
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05/02/2024 10:51 PM
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