Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 057899/0201 | |
| Pages: | 6 |
| | Recorded: | 10/25/2021 | | |
| Attorney Dkt #: | P210950US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17509378
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Filing Dt:
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10/25/2021
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Publication #:
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Pub Dt:
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04/28/2022
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Title:
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THERMOSETTING SHEET, DICING DIE BONDING FILM, AND SEMICONDUCTOR APPARATUS
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Assignee
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, OSAKA, JAPAN 567-8680 |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LLP
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8500 LEESBURG PIKE
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SUITE 7500
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TYSONS, VA 22182
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