Patent Assignment Details
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| Reel/Frame: | 057908/0187 | |
| Pages: | 8 |
| | Recorded: | 10/21/2021 | | |
| Attorney Dkt #: | JIP004 |
| Conveyance: | TO CORRECT THE ADDRESS OF THE ASSIGNEE IN TWO COVER SHEETS PREVIOUSLY RECORDED ON REEL/FRAME 057102/0285 AND REEL/FRAME 057143/0524 |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17428822
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Filing Dt:
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08/05/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Title:
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HEAT DISSIPATION-ELECTROMAGNETIC SHIELDING EMBEDDED PACKAGING STRUCTURE, MANUFACTURING METHOD THEREOF, AND SUBSTRATE
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Assignee
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| FPC FACTORY, NO. 3209, NORTH ZHUFENG AVENUE |
| DOUMEN, GUANGDONG PROVINCE |
| ZHUHAI CITY, CHINA 519175 |
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Correspondence name and address
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NIKOLAS J. UHLIR
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55 SOUTH COMMERCIAL STREET, B14
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GROSSMAN TUCKER PERREAULT & PFLEGER PLLC
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MANCHESTER, NH 03101
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