Patent Assignment Details
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| Reel/Frame: | 057960/0290 | |
| Pages: | 6 |
| | Recorded: | 10/29/2021 | | |
| Attorney Dkt #: | 2515.0503 CON |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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17452824
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Filing Dt:
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10/29/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Title:
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Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C.
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123 W. CHANDLER HEIGHTS ROAD, #12535
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CHANDLER, AZ 85248
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