Patent Assignment Details
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| Reel/Frame: | 058043/0317 | |
| Pages: | 4 |
| | Recorded: | 11/08/2021 | | |
| Attorney Dkt #: | BOXP277WOUS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17453892
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Filing Dt:
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11/08/2021
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Publication #:
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Pub Dt:
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01/12/2023
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Title:
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SEMICONDUCTOR DEVICE LAYOUT STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR DEVICE
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Assignee
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| NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI CITY, ANHUI, CHINA 230000 |
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Correspondence name and address
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COOPER LEGAL GROUP, LLC
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1388 RIDGE ROAD, UNIT 1
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HINCKLEY, OH 44233
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