Patent Assignment Details
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| Reel/Frame: | 058208/0228 | |
| Pages: | 4 |
| | Recorded: | 11/24/2021 | | |
| Attorney Dkt #: | TSU11102P00110US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17290145
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Filing Dt:
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04/29/2021
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Publication #:
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Pub Dt:
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01/06/2022
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Title:
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COMPOUND SEMICONDUCTOR DEVICE, COMPOUND SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING COMPOUND SEMICONDUCTOR DEVICE
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Assignee
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| 12-8, 2-CHOME, MINAMI SEMBA |
| CHUO-KU, OSAKA-SHI, OSAKA, JAPAN 5420081 |
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Correspondence name and address
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WOOD, PHILLIPS, KATZ, CLARK & MORTIMER
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500 W. MADISON STREET
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SUITE 1130
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CHICAGO, IL 60661-2562
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