Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058212/0310 | |
| Pages: | 3 |
| | Recorded: | 11/26/2021 | | |
| Attorney Dkt #: | 067237-2014 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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17529972
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Filing Dt:
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11/18/2021
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Publication #:
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Pub Dt:
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05/18/2023
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Title:
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SEMICONDUCTOR DEVICE HAVING WIRING SUBSTRATE WITH LEAD-OUT WIRINGS
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Assignee
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| 2-24, TOYOSU 3-CHOME, KOTO-KU |
| TOKYO, JAPAN 135-0061 |
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Correspondence name and address
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TOMOKI TANIDA
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MCDERMOTT WILL & EMERY LLP
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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