Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058229/0095 | |
| Pages: | 5 |
| | Recorded: | 11/29/2021 | | |
| Attorney Dkt #: | 2020-5549/24061.4395US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17536724
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Filing Dt:
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11/29/2021
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Publication #:
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Pub Dt:
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09/01/2022
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Title:
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Bonded Semiconductor Device And Method For Forming The Same
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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HAYNES AND BOONE, LLP (24061) IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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04/29/2024 03:36 AM
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