Patent Assignment Details
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| Reel/Frame: | 058251/0583 | |
| Pages: | 7 |
| | Recorded: | 12/01/2021 | | |
| Attorney Dkt #: | TSMCP1071USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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17539258
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Filing Dt:
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12/01/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Title:
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BACKSIDE CONTACT FOR THERMAL DISPLACEMENT IN A MULTI-WAFER STACKED INTEGRATED CIRCUIT
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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629 EUCLID AVE.
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SUITE 1101
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CLEVELAND, OH 44114
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