Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 058262/0994 | |
| Pages: | 4 |
| | Recorded: | 12/01/2021 | | |
| Attorney Dkt #: | 10018-01-0063-US-DIV1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2023
|
Application #:
|
17540224
|
Filing Dt:
|
12/01/2021
|
|
Publication #:
|
|
Pub Dt:
|
03/24/2022
| | | | |
|
Title:
|
BONDED UNIFIED SEMICONDUCTOR CHIPS AND FABRICATION AND OPERATION METHODS THEREOF
|
|
|
Assignee
|
|
|
|
|
| 18 GAOXIN 4TH ROAD |
| ECONOMIC & TECHNOLOGICAL DEVELOPMENT ZONE |
| WUHAN, HUBEI, CHINA |
|
|
Correspondence name and address
|
| |
BAYES PLLC
|
| |
8260 GREENSBORO DRIVE
|
| |
SUITE 625
|
| |
MCLEAN, 22102 UNITED STATES
|
Search Results as of:
05/14/2024 11:08 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
