Patent Assignment Details
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| Reel/Frame: | 058319/0971 | |
| Pages: | 6 |
| | Recorded: | 12/07/2021 | | |
| Attorney Dkt #: | 5649.5455 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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17458873
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Filing Dt:
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08/27/2021
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Publication #:
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Pub Dt:
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07/28/2022
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Title:
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SEMICONDUCTOR DEVICES INCLUDING VIA STRUCTURES HAVING A VIA PORTION AND A BARRIER PORTION
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Assignee
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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MYERS BIGEL, P.A.
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4140 PARKLAKE AVENUE
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SUITE 600
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RALEIGH, NC 27612
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