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Reel/Frame:058394/0067   Pages: 7
Recorded: 12/15/2021
Attorney Dkt #:TSU11102P00130US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17423295
Filing Dt:
07/15/2021
Publication #:
Pub Dt:
03/03/2022
Title:
COMPOUND SEMICONDUCTOR SUBSTRATE
Assignors
1
Exec Dt:
07/07/2021
2
Exec Dt:
07/07/2021
3
Exec Dt:
07/07/2021
4
Exec Dt:
07/07/2021
Assignee
1
12-8, MINAMI SEMBA 2-CHOME, CHUO-KU
OSAKA-SHI, OSAKA, JAPAN 5420081
Correspondence name and address
WOOD, PHILLIPS, KATZ, CLARK & MORTIMER
500 W. MADISON STREET
SUITE 1130
CHICAGO, IL 60661-2562

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