Patent Assignment Details
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| Reel/Frame: | 058427/0829 | |
| Pages: | 6 |
| | Recorded: | 12/20/2021 | | |
| Attorney Dkt #: | 8836S-1833 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/02/2024
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Application #:
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17555583
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Filing Dt:
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12/20/2021
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Publication #:
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Pub Dt:
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11/03/2022
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING A SUPPORT SOLDER BALL
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Assignee
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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F. CHAU & ASSOCIATES, LLC
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130 WOODBURY RD.
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WOODBURY, NY 11797
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Search Results as of:
05/03/2024 03:25 AM
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