Patent Assignment Details
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| Reel/Frame: | 058435/0089 | |
| Pages: | 5 |
| | Recorded: | 12/20/2021 | | |
| Attorney Dkt #: | MAE-808 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17556450
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Filing Dt:
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12/20/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Title:
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SEMICONDUCTOR ELEMENT UNIT AND METHOD OF MANUFACTURING THEREOF, SEMICONDUCTOR ELEMENT UNIT SUPPLY SUBSTRATE, AND SEMICONDUCTOR PACKAGING CIRCUIT AND METHOD OF MANUFACTURING THEREOF
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Assignee
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| 1-7-12 TORANOMON, MINATO-KU |
| TOKYO, JAPAN 105-8460 |
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Correspondence name and address
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RABIN & BERDO, P.C.
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2650 PARK TOWER DRIVE, SUITE 800
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VIENNA, VA 22180
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