Patent Assignment Details
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| Reel/Frame: | 058461/0761 | |
| Pages: | 5 |
| | Recorded: | 12/22/2021 | | |
| Attorney Dkt #: | TAI-447 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17507361
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Filing Dt:
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10/21/2021
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Publication #:
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Pub Dt:
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04/28/2022
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Title:
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER
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Assignee
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| 2-4-8 SHINYOKOHAMA, KOUHOKU-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 222-8575 |
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Correspondence name and address
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RABIN & BERDO, P.C.
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2650 PARK TOWER DRIVE, SUITE 800
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VIENNA, VA 22180
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04/27/2024 07:41 PM
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