Patent Assignment Details
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| Reel/Frame: | 058480/0331 | |
| Pages: | 5 |
| | Recorded: | 12/27/2021 | | |
| Attorney Dkt #: | H-322 (FP1100074) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17562211
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Filing Dt:
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12/27/2021
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Publication #:
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Pub Dt:
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06/29/2023
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Title:
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CHIP-MIDDLE TYPE FAN-OUT PANEL-LEVEL PACKAGE AND PACKAGING METHOD THEREOF
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Assignee
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| NO.10, DATONG RD. |
| HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352 |
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Correspondence name and address
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JAMES WALTERS; PATENTTM.US
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P.O. BOX 82788
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PORTLAND, OR 97282-0788
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05/14/2024 09:52 AM
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