Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058488/0927 | |
| Pages: | 2 |
| | Recorded: | 12/28/2021 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17616813
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Filing Dt:
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12/06/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Title:
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SEMICONDUCTOR CHIP INTEGRATED DEVICE MANUFACTURING METHOD, SEMICONDUCTOR CHIP INTEGRATED DEVICE, SEMICONDUCTOR CHIP INTEGRATED DEVICE ASSEMBLY, SEMICONDUCTOR CHIP INK, AND SEMICONDUCTOR CHIP INK EJECTION DEVICE
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Assignee
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| ROOM 205, ASAHI PLAZA JOZENJIKITA, 11-13 |
| KOKUBUNCHO 3-CHOME, AOBA-KU, SENDAI-SHI |
| MIYAGI, JAPAN 9800803 |
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Correspondence name and address
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K&L GATES
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P.O. BOX 1135
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CHICAGO, IL 60690-1135
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