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Patent #:
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Issue Dt:
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03/22/2005
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Application #:
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09689476
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Filing Dt:
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10/12/2000
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Title:
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PULSED OPERATION OF HALL-CURRENT ION SOURCES
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Patent #:
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Issue Dt:
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05/24/2005
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Application #:
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09855485
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Filing Dt:
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05/14/2001
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Title:
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MACHINE-INDEPENDENT ALIGNMENT SYSTEM AND METHOD
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Patent #:
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Issue Dt:
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07/20/2004
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Application #:
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10038483
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Filing Dt:
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01/03/2002
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Publication #:
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Pub Dt:
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03/11/2004
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Title:
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HIGH DENSITY INTERCONNECTS
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Patent #:
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Issue Dt:
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03/23/2004
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Application #:
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10041392
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Filing Dt:
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01/08/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Title:
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METHOD FOR FORMING SOLDER CONNECTIONS ON A CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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06/07/2005
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Application #:
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10046426
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Filing Dt:
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01/16/2002
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Publication #:
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Pub Dt:
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12/12/2002
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Title:
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REACTOR HAVING A MOVABLE SHUTTER
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Patent #:
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Issue Dt:
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05/11/2004
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Application #:
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10052591
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Filing Dt:
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01/18/2002
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Publication #:
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Pub Dt:
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07/24/2003
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Title:
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HIGH DENSITY RAISED STUD MICROJOINING SYSTEM AND METHODS OF FABRICATING THE SAME
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10052620
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Filing Dt:
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01/18/2002
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Publication #:
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Pub Dt:
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07/24/2003
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Title:
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HIGH DENSITY AREA ARRAY SOLDER MICROJOINING INTERCONNECT STRUCTURE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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01/10/2006
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Application #:
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10102242
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Filing Dt:
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03/19/2002
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Publication #:
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Pub Dt:
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03/13/2003
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Title:
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GONIOMETER
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Patent #:
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Issue Dt:
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06/24/2003
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Application #:
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10119491
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Filing Dt:
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04/09/2002
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Title:
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METHOD AND STRUCTURE FOR JOINING TWO SUBSTRATES WITH A LOW MELT SOLDER JOINT
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Patent #:
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Issue Dt:
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04/06/2004
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Application #:
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10126928
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Filing Dt:
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04/19/2002
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Title:
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METHOD AND APPARATUS FOR CONTROLLING FILM PROFILES ON TOPOGRAPHIC FEATURES
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Patent #:
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Issue Dt:
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05/25/2004
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Application #:
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10145467
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Filing Dt:
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05/13/2002
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Publication #:
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Pub Dt:
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11/13/2003
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Title:
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SMT PASSIVE DEVICE NOFLOW UNDERFILL METHODOLOGY AND STRUCTURE
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Patent #:
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Issue Dt:
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07/22/2003
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Application #:
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10151075
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Filing Dt:
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05/17/2002
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Title:
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METHOD OF FORMING A LEAD-FREE TIN-SILVER-COPPER BASED SOLDER ALLOY ON AN ELECTRONIC SUBSTRATE.
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Patent #:
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Issue Dt:
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12/23/2003
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Application #:
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10162830
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Filing Dt:
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06/04/2002
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Publication #:
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Pub Dt:
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12/12/2002
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Title:
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BALL GRID ARRAY MODULE AND METHOD OF MANUFACTURING SAME
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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10215451
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Filing Dt:
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08/09/2002
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Title:
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NEGATIVE VOLUME EXPANSION LEAD-FREE ELECTRICAL CONNECTION
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Patent #:
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Issue Dt:
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05/17/2005
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Application #:
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10248976
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Filing Dt:
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03/06/2003
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Publication #:
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Pub Dt:
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09/09/2004
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Title:
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DUAL-SOLDER FLIP-CHIP SOLDER BUMP
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Patent #:
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Issue Dt:
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07/12/2005
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Application #:
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10249621
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Filing Dt:
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04/24/2003
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Publication #:
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Pub Dt:
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10/28/2004
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Title:
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LEAD-FREE ALLOYS FOR COLUMN/BALL GRID ARRAYS, ORGANIC INTERPOSERS AND PASSIVE COMPONENT ASSEMBLY
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Patent #:
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Issue Dt:
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11/18/2003
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10262753
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Filing Dt:
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10/01/2002
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Title:
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SELECTIVE C4 CONNECTION IN IC PACKAGING
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Patent #:
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Issue Dt:
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12/07/2004
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Application #:
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10263849
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10/03/2002
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Publication #:
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Pub Dt:
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08/07/2003
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Title:
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MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC
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Patent #:
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Issue Dt:
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06/08/2004
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Application #:
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10287864
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Filing Dt:
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11/06/2002
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Publication #:
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Pub Dt:
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05/06/2004
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Title:
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LASER SCANNING APPARATUS AND METHODS FOR THERMAL PROCESSING
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Patent #:
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Issue Dt:
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04/12/2005
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Application #:
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10330567
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Filing Dt:
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12/27/2002
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Publication #:
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Pub Dt:
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07/01/2004
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Title:
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LARGE-FIELD UNIT-MAGNIFICATION PROJECTION SYSTEM
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Patent #:
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Issue Dt:
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11/02/2004
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Application #:
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10336066
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Filing Dt:
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01/02/2003
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Publication #:
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Pub Dt:
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07/08/2004
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Title:
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VARIABLE NUMERICAL APERTURE LARGE-FIELD UNIT-MAGNIFICATION PROJECTION SYSTEM
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Patent #:
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Issue Dt:
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08/03/2004
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Application #:
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10371466
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Filing Dt:
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02/21/2003
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Publication #:
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Pub Dt:
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11/27/2003
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Title:
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SELECTIVE FILLING OF ELECTRICALLY CONDUCTIVE VIAS FOR THREE DIMENSIONAL DEVICE STRUCTURES
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Patent #:
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Issue Dt:
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01/18/2005
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10390504
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Filing Dt:
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03/13/2003
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Title:
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METHOD AND SYSTEM FOR LASER THERMAL PROCESSING OF SEMICONDUCTOR DEVICES
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03/08/2005
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10447128
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05/27/2003
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Pub Dt:
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12/02/2004
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Title:
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DEEP ULTRAVIOLET UNIT-MAGNIFICATION PROJECTION OPTICAL SYSTEM AND PROJECTION EXPOSURE APPARATUS
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11/16/2004
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10605752
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10/23/2003
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11/25/2004
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Title:
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IMPROVEMENTS IN GROUNDING AND THERMAL DISSIPATION FOR INTEGRATED CIRCUIT PACKAGES
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07/27/2010
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10653625
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09/02/2003
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03/03/2005
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Title:
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LASER THERMAL PROCESSING WITH LASER DIODE RADIATION
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12/12/2006
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10674106
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09/29/2003
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03/31/2005
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Title:
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LASER THERMAL ANNEALING OF LIGHTLY DOPED SILICON SUBSTRATES
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11/16/2004
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10692065
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10/23/2003
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05/06/2004
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Title:
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HIGH DENSITY AREA ARRAY SOLDER MICROJOINING INTERCONNECT STRUCTURE AND FABRICATION METHOD
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08/29/2006
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10762861
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01/22/2004
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05/19/2005
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LASER THERMAL ANNEALING OF LIGHTLY DOPED SILICON SUBSTRATES
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02/27/2007
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10772132
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02/04/2004
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08/26/2004
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01/02/2007
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10806014
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03/22/2004
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09/09/2004
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02/01/2011
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08/11/2004
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02/17/2005
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10/03/2006
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10/29/2004
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12/12/2006
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11/01/2004
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05/04/2006
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11/29/2011
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11/18/2004
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06/08/2010
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12/01/2004
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06/01/2006
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02/13/2007
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02/07/2005
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07/07/2005
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03/11/2008
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02/18/2005
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11/10/2005
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02/13/2007
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11112647
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04/22/2005
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10/26/2006
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08/04/2009
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05/12/2005
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12/29/2005
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10/02/2007
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11129548
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05/13/2005
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10/06/2005
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06/19/2012
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06/27/2005
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02/02/2006
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05/11/2010
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03/31/2006
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11/09/2006
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02/01/2011
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06/29/2006
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11/02/2006
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03/17/2015
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10/06/2006
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06/14/2007
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07/07/2009
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02/26/2007
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09/25/2008
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04/30/2007
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10/30/2008
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01/18/2011
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10/23/2008
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06/29/2010
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06/20/2007
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06/05/2012
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09/24/2007
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12/14/2010
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04/17/2012
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02/26/2008
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12/08/2015
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04/16/2009
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03/08/2011
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08/31/2010
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09/23/2010
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12/11/2012
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02/11/2010
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11/03/2015
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09/30/2010
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07/01/2010
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06/10/2010
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10/18/2011
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07/21/2011
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09/30/2010
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09/02/2010
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02/02/2012
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11/13/2012
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04/05/2012
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06/17/2014
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04/19/2012
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08/25/2011
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06/21/2012
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09/08/2011
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11/17/2011
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