Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058607/0393 | |
| Pages: | 52 |
| | Recorded: | 01/04/2022 | | |
| Attorney Dkt #: | 20374-149561-US |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/15/2022
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Application #:
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16979781
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Filing Dt:
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09/10/2020
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Publication #:
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Pub Dt:
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01/21/2021
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Title:
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TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATIONMOLDING, LEAD FRAME PROVIDED WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATED MOLDED BODY PROVIDED WITH TEMPORARY PROTECTIVEFILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, |
| TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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1250 23RD STREET NW, SUITE 410
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WASHINGTON,, DC 20037-1164
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