Patent Assignment Details
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| Reel/Frame: | 058724/0104 | |
| Pages: | 4 |
| | Recorded: | 01/21/2022 | | |
| Attorney Dkt #: | 00150.0042.00US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17629040
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Filing Dt:
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01/21/2022
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Publication #:
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Pub Dt:
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09/01/2022
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Title:
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PACKAGING STRUCTURE HAVING SEMICONDUCTOR CHIPS AND ENCAPSULATION LAYERS AND FORMATION METHOD THEREOF
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Assignees
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| #99 JIANGDA RD, SUTONG INDUSTRY PARK |
| NANTONG, CHINA 226000 |
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| NO. 288, CHONGCHUAN ROAD |
| NANTONG, CHINA 226000 |
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Correspondence name and address
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ANOVA LAW GROUP, PLLC
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21495 RIDGETOP CIRCLE, SUITE 300
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STERLING, VA 20166
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05/21/2024 11:33 AM
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